High performance computing chips, as those used in AI and data centers require high performance dc-dc power converters. A first challenge is to supply low voltages 0.5-1.2V with AVS (adaptive voltage scaling), high current (up to 15,000A) and very demanding load steps (up to 5,000A/us). A second challenge is a high and variable voltage gain to generate a tight supply voltage from a 48Vdc bus. Low losses (peak efficiency >97%) and high surface current density (>1A/mm2) complete these high performance requirements.
Proposed “SURFACE power delivery” is an extension of the “VERTICAL power delivery” trend that is replacing “LATERAL power delivery” in high current applications to reduce copper losses in the power delivery path.
Three novel concepts are described in this talk: a) “extended duty cycle” (60-95%) in both primary and secondary power switches; b) “segmented winding transformer, SWT” and c) “edge dynamics”. These three concepts are implemented in a novel “Direct Power Converter with High Voltage inside, DPx-HV”