IS10 - Advances in 3D-Packaging Technology for Power Electronics

Wednesday, February 28, 2024

8:30 AM – 11:55 AM PST

Location: 201A

Industry Session Chair(s)

8:30 AM – 8:55 AM PST

Common Mode Noise and Minimizing Emissions through Packaging Technology
Industry Session Presenter: Douglas C. Hopkins, PhD – North Carolina State University
8:55 AM – 9:20 AM PST

Packaging for IoT device energy harvesting solutions – roadmap and considerations
Industry Session Presenter: Brian Zahnstecher, ME (he/him/his) – PowerRox LLC
Industry Session Presenter: Mike Hayes, MEngSc (he/him/his) – Tyndall National Institute
9:20 AM – 9:45 AM PST

Efficiency improvements for power conversion units by means of PCB embedding technology for fast switching devices like SiC and GaN
Industry Session Presenter: Thomas Gottwald, Dipl. Ing. (FH) (he/him/his) – Schweizer Electronic AG, Germany
9:45 AM – 10:10 AM PST

Innovation and Collaboration in Power Module Packaging and HVM in the Fast Changing World
Industry Session Presenter: Thomas Yung-Lin Wang – Advanced Semiconductor Engineering, Inc.
10:40 AM – 11:05 AM PST

On-Shoring Power Packaging
Industry Session Presenter: Charles Woychik, PkhD – NHanced Semiconductors, Inc.
11:05 AM – 11:30 AM PST

Empowering Chiplets Through Vertical Power Delivery
Industry Session Presenter: Siddharth Ravichandran, PhD (he/him/his) – Chipletz, Austin, TX, USA
11:30 AM – 11:55 AM PST

AI-Driven Reliability of Solar Power Inverters
Industry Session Presenter: Patrick McCluskey, PhD (he/him/his) – University of Maryland, College Park