Director
TSMC
Shenggao Li, IEEE Sr. Member 2005, Member 1997, received his PhD, MS, and BS degree from The Ohio-state University, Tsinghua University, Northwestern Polytechnical University, respectively. He is currently a director with the Mixed-signal and RF Solutions Division in TSMC, North America, with a primary focus on energy efficient interconnects, including chiplet and 3D-IC interconnects, such as UCIe and Lipincon physical layer, and high-speed ADCs for wireless and wireline communications. Prior to that, he was a Principal Engineer and section leader responsible for Intel’s PCIe Gen3.0, Gen4.0 and Gen5.0, and UPI PHY development for 5 generations of Xeon CPU products. He serves in the Technical Program Committee for Wireline in CICC 2022, 2023, 2024, and Sponsorship Chair in CICC 2023 and 2024. He is currently a co-chair in the UCIe consortium on Form-factor and Compliance Working Group. Shenggao has authored over 30+ patents, numerous ISSCC/JSSCC publications and was an invited speaker on 3D-IC interconnects in CICC 2022 & ISSCC 2023.
IS07.6 - Power Delivery for High-Speed Die to Die Interconnects and Future 3D-ICs
Wednesday, February 28, 2024
11:05 AM – 11:30 AM PST