Member of Technical Staff
Chipletz, Austin, TX, USA
Siddharth Ravichandran received his Ph.D. in Electrical & Computer Engineering from Georgia Institute of Technology. As part of his graduate research, he worked at the 3D Systems Packaging Research Center at Georgia Tech where he developed advanced glass packages for RF, mm-wave, and high-performance computing (HPC) applications. Siddharth has received several awards including the IEEE Electronics Packaging Society (EPS) PhD Fellowship Award for his contributions to the development of 2.5D and 3D glass packages for heterogeneous integration, and the Roger Webb Award for Excellence in Research from Georgia Tech for his work on Glass-based 3D packages. He also received the IEEE EPS “Future Packaging Vision” Award at the 2019 ECTC. Siddharth has an extensive list of patents, journal and conference publications, magazine articles, and co-authored 3 chapters in the Fundamentals of Device and System Packaging Textbook.
Currently, Siddharth is working with Chipletz in Austin, Texas, focusing on technology development of advanced 2.5D and 3D package architectures and integrated passive devices for chiplet integration in AI and high-performance computing applications. His research interests include heterogeneous integration, 2.5D/3D architectures, power delivery, and advanced packages & systems for high-performance computing.
IS10.6 - Empowering Chiplets Through Vertical Power Delivery
Wednesday, February 28, 2024
11:05 AM – 11:30 AM PST