Do you have what it takes to design the next breakthrough in SiC packaging?
The three-phase $2.25 million Silicon Carbide (SiC) Packaging Prize—launched by the U.S. Department of Energy’s Office of Electricity—was established to develop and expand upon state-of-the-art semiconductor packaging designs. SiC power modules, though prime candidates for high-performance electronics, are often limited by traditional packaging techniques. To enable grid-based applications, SiC power modules must support higher voltage and higher current ratings.
Join us for an overview of the prize to learn more about the importance of this research and how you can play a part in moving the industry beyond its current state. Plus, hear more on other prizes opportunities from the Office of Electricity and the American-Made prize program.
