TDK will introduce a new, highly precise, copper electro-plating patterning technology that allows for antenna [coil] thicknesses down to the 3 um level. These, combined with new, non-ferrite magnetic shielding materials in the 25-200 um range, yield complete antenna assemblies as thin as 35 um. The innovative electro-plating technology also allows for adjustable thickness and the flexibility to adjust per each application’s current requirements. These antenna assemblies target NFC charging, Qi [WPC], AirFuel (6.78 MHz) or other proprietary wireless power technologies where thickness, rather thinness, is at a premium.
