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Industry
PSMA Session
Session: Advances in 3D-Packaging Technology for Power Electronics
IS10.4 - Innovation and Collaboration in Power Module Packaging and HVM in the Fast Changing World
Wednesday, February 28, 2024
9:45 AM – 10:10 AM
PST
Location: 201A
Industry Session Presenter(s)
Thomas Yung-Lin Wang
Director
Advanced Semiconductor Engineering, Inc.
Presentation