New power semiconductor technologies enable power converters to achieve higher power density and better thermal performance. However, they come with new system design challenges. This work discusses 2 of these new technologies; the first one is Gallium Nitride (GaN) and the second one is chip-embedding of Si MOSFETs which means that the MOSFET die is embedded inside the printed circuit board (PCB). The work discusses system design aspects of a 2.4 kW HV/LV DC-DC converter used for charging the 12 V auxiliary battery in an electric vehicle (EV). This is done through deploying the two new technologies, going through the system design considerations for the DC-DC Converter, providing a layout example and testing the prototype in a lab environment. The converter is split into 2 boards HV and LV. This digest serves as an introduction to the different elements in this work.
