In this work, design, fabrication, analysis, and experimental validation of a new GaN power module for high-frequency applications were carried out. The module featured a new ultra-thin substrate to provide high heat dissipation and dense packaging. FEA simulations were performed to verify the module’s thermos-mechanical acceptability, followed by DPT electrical testing. Finally, hardware testing of a 60V:12V, 33A (400W) Buck converter verified the simulation. The final paper will also include a detailed design of the GaN power module design from an electrical, thermal, and mechanical stress handling capacity perspective and describe experimental testing of the buck converter. A comparative analysis with similar buck converters (single and multiphase) used IBAs will be made in terms of power levels and power density (power module figure of merit) in the final paper.