The design of heat sinks is crucial for power modules in power electronic systems. Jet-impingement cooling has been proven to be an efficient and compact solution, but previous designs believed that the losses of each chip inside the power module are uniform, which would lead to the appearance of weak points. The inconsistent loss of multi-chip within the power module is caused by mismatched parasitic parameters and thermal resistances, which is experimentally confirmed to be the case for SiC MOSFET power modules in this paper. An unbalanced hot-spot-based jet-impingement cooling concept is proposed to suppress the inherent uneven temperature of power modules, and the effectiveness of this method is verified by theoretical modelling and experiments tentatively. In the future, the proposed cooling concept for heat sinks design considering electro-thermal coupling will be more carefully sought and verified in experiments on converter operation.
