In this paper, an accurate and fast switching loss measurement method is proposed to evaluate the switching loss of wide bandgap (WBG) devices. An accurate thermal model is constructed for half-bridge topologies. The measurement setup separates the interference of other heat sources and keeps the device as the only heat source. By monitoring and sampling the temperature directly on the device case in a short time interval, the heat and power loss condition that can most represent the device junction is acquired discretely without considering whether the device heat is in transient temperature-rising state or thermal equilibrium. The experimental result is presented with the proposed method using Infineon GaN HD-GIT device in the half-bridge buck platform.
