IS13 - Datacenter & Telecommunication Applications

Wednesday, February 28, 2024

1:30 PM – 4:55 PM PST

Location: Grand Ballroom B

Industry Session Chair(s)

1:30 PM – 1:55 PM PST

Liquid Immersion Cooling for Datacenter Server SMPS
Industry Session Presenter: Ashish Ekbote, MSEE – Infineon Technologies
1:55 PM – 2:20 PM PST

In-Package DC-DC Conversion Simplifies and Improves the Performance of Deep Submicron Ai/xPU Power Domains
Industry Session Presenter: Trey A. Roessig, PhD (he/him/his) – Empower Semiconductor
2:20 PM – 2:45 PM PST

500 kHz High Density 3 kW GaN Rectifier for Server and Telecom Applications
Industry Session Presenter: David Meneses Herrera, PhD – Infineon Technologies Nordic
2:45 PM – 3:10 PM PST

Achieve Robust Power Path Protection in High-Power High-density Servers Using eFuses
Industry Session Presenter: Abhinay Patil, BE (he/him/his) – Texas Instruments
3:40 PM – 4:05 PM PST

Stackable Integrated Buck Regulator for Point – of – Load Applications
Industry Session Presenter: Min Chen, PhD – Infineon Technologies AG
4:05 PM – 4:30 PM PST

The Challenges of 12V Input for Dual Entry Power Design and the Future of 48V HVDC in Data Center
Industry Session Presenter: Patt Chang, MA – Intel
Industry Session Presenter: Chi Hsu, MA (he/him/his) – Google LLC
Industry Session Presenter: Shuai Jiang, PhD – Google LLC
Industry Session Presenter: Zichao Ye – University of California, Berkeley
4:30 PM – 4:55 PM PST

High Power Dense and Ultra-Flat AC-DC Power Supplies with Hold-up Time Requirement
Industry Session Presenter: Alessandro Pevere, PhD – Infineon Technologies