IS19 - SiC & Package Innovations in Power Modules

Industry Session Chair(s)

• 

  Ajay Hari

  Applications Director
  Onsemi
• 

  Stephen Oliver, MBA (he/him/his)

  VP Corporate Marketing & Investor Relations
  Navitas Semiconductor

Presentations:

• 8:30 AM – 8:55 AM PST

  New Concept of Cooled and Compact Fuse by Direct Integration into Power Modules
  

  Industry Session Presenter: Laurent Milliere, PhD (he/him/his) – Mersen
• 8:55 AM – 9:20 AM PST

  Thermal Performance Evaluation of Dual-Side Cooling SiC MOSFET Power Modules with Integrated Electromagnetic-Thermal Methodology for Busbar Heating Analysis
  

  Industry Session Presenter: Ludovica Longo, ENG (she/her/hers) – STMicroelectronics
• 9:20 AM – 9:45 AM PST

  Practical Applications for SiC Power Module SPICE Models
  

  Industry Session Presenter: Brian Deboi, PhD (he/him/his) – Wolfspeed
• 9:45 AM – 10:10 AM PST

  Sensitivity Analysis to Maximize Performance in SiC Power Modules Connected in Parallel
  

  Industry Session Presenter: Antonia Lanzafame, MD (she/her/hers) – STMicroelectronics

  Industry Session Presenter: Vittorio Giuffrida – STMicroelectronics

  Industry Session Presenter: Massimiliano Chiantello – STMIcroelectronics
• 10:30 AM – 10:55 AM PST

  Understanding the Impact of PCB Design on Silicon Carbide (SiC) Power Module Ampacity
  

  Industry Session Presenter: Dereje Woldegiorgis, PhD (he/him/his) – Wolfspeed Inc
• 10:55 AM – 11:20 AM PST

  Evaluation of an Industry Standard Package Optimized for 600A SiC Mosfets
  

  Industry Session Presenter: Michael Rogers – Mitsubishi Electric US Inc.