IS23 - Component Packaging, Protection & Safety

Industry Session Chair(s)

• 

  Douglas Hopkins, PhD

  Professor
  PREES Lab at NC State University
  North Carolina State University
  NC State University
• MP

  Markondeyaraj Pulugurtha

  Florida International University

Presentations:

• 8:30 AM – 8:55 AM PST

  Circuit for Disabling Inrush Shorting Protection Relay During Light/No-load Condition
  

  Industry Session Presenter: Richard Hester – Power Integrations
• 8:55 AM – 9:20 AM PST

  Thermoelectrical Analysis and Performance: A Comparative Study Between Modular and Discrete Approaches
  

  Industry Session Presenter: Domenico Nardo, MD – STMicroelectronics
• 9:20 AM – 9:45 AM PST

  Package Safety Isolation Testing for Integrated Power Devices
  

  Industry Session Presenter: Thomas Anthony F. Capobianco – Power Integrations
• 9:45 AM – 10:10 AM PST

  Achieving Thermal Shock Reliability Enhancement Against Thick Cu Substrate in Die Attach with a High Thermal Conductive Foil
  

  Industry Session Presenter: Oji Sato, MEng (he/him/his) – ROHM Co., Ltd
• 10:30 AM – 10:55 AM PST

  Demystifying Creepage and Clearance Distance for High-Voltage End Equipment
  

  Industry Session Presenter: Thomas LaBella, PhD (he/him/his) – Texas Instruments
• 10:55 AM – 11:20 AM PST

  A Supercapacitor-based Surge Protection Technique Satisfying UL 1449 3rd Edition Tests
  

  Industry Session Presenter: Nihal Kularatna, DSc – The University of Waikato