The market outlook for Silicon Carbide (SiC) devices is promising. Every player has its own solutions for die design and packaging integration, driven by performance and cost. The presentation gives an overview of the SiC transistors and modules market, players and available technologies. It also aims at defining the different cost drivers of the new technologies in SiC power devices and understand the reason of the success of specific packaging or design. Different devices have been opened and analyzed to understand the SiC technology innovations and a breakdown cost analysis of the manufacturing process has been developed. The presentation includes deep technical analysis of each technology supported by optical and SEM pictures. The cost analyses are the results of description of production process and software calculation of all the parameters which have an impact on final manufacturing cost.
