The goal of this paper is to introduce a new concept of cooled and integrated fuse aiming to offer superior electrical protection like but not limited to lower I2t, lower peak let thru, better cycling performance. This new fuse concept will be directly installed on a cooling plate like any other power semiconductor modules. It targets DC applications up to 1000V DC and 1500 VDC in the near future. These fuses were created using new numerical tools by multiphysical modeling under thermal monitoring. According to a unique design process, the heating of the fuse induced by a current is then dissipated by direct heat transfer with the cold plate. Thus, this concept gives the fuse the advantage of being 3 times more compact than a standard. Currently, the fuse rating ranges from 330 A to 1000A with a cold plate set at 65°C. Its dimensions are like a 100x45x30mm IGBT module in order to facilitate its installation. Applications like mega charging stations, electrical energy storage, EV (due to the lower weight of the new fuse) …will beneficiate from these performances featured by the new design. Application with large L/R > 10 mS will still be addressed by fuse standard design.
