IS19.2 - Thermal Performance Evaluation of Dual-Side Cooling SiC MOSFET Power Modules with Integrated Electromagnetic-Thermal Methodology for Busbar Heating Analysis

The objective of this project is to develop dual-side cooling (DSC) power modules based on silicon carbide (SiC) MOSFETs for electric vehicles. To ensure effective operation, power module (PM) design must consider the connection between the PM, DC-link, and engine, as they are subjected to high current levels. To ensure optimal performance and reliability, the proposed methodology employs the finite element model (FEM) in the Ansys electronic simulation environment, which integrates the electromagnetic model (EM) and conjugate heat transfer (CHT) analysis. The methodology is implemented at a specific current level based on a particular mission profile (MP). The proposed methodology is a significant step towards achieving the objective of developing efficient and reliable power modules for electric vehicles. It allows for a more precise and comprehensive analysis of power module performance under specific conditions.