Designing systems that take advantage of the higher efficiency and power density of SiC power modules requires careful consideration of their high edge-rates and failure mechanisms. Simulation tools can reduce the cost and time required to develop and optimize power electronics systems through virtual prototyping. SPICE models are commonly employed for these purposes, as they provide a high level of detail in predicting the transient behavior of devices during operation. This presentation discusses the advantages and disadvantages of SPICE simulation and provides examples of practical applications where SPICE models are useful for designing systems using SiC power modules. Attendees will gain insight on how to best apply SPICE models to their power electronic designs.
