Proper high voltage PCB spacing and IC package selection are very important to achieve the highest possible power density while still maintaining compliance with safety and design guidelines. However, there are many standards addressing creepage and clearance – some complimentary, some redundant, some conflicting – and many technical terms that need to be understood in order to use them. This presentation will review the definitions for critical terms, discuss the impact each has on creepage and clearance, and introduce the various standards addressing creepage and clearance. Then a flow chart with a step-by-step structured methodology for determining creepage, clearance, and high voltage PCB spacing will be given followed by real-world examples.
