T29 - Practical Design Considerations for Power Modules

Thursday, February 29, 2024

8:30 AM – 11:10 AM PST

Location: 101A

Technical Lecture Session Chair(s)

8:30 AM – 8:50 AM PST

New Snap-Off Free 1200 V Diode Technology with Active Rear-Side Structure for Enhanced System Performance
Technical Lecture Presenter: Christian R. Müller, PhD (he/him/his) – Infineon Technologies AG
8:50 AM – 9:10 AM PST

Designing of a >1kV Medium-Voltage Line Impedance Stabilization Network
Technical Lecture Presenter: Tahmid Ibne Mannan (he/him/his) – Mississippi State University
9:10 AM – 9:30 AM PST

Volume Minimization of Current Type ACC with Rogowski Coil
Technical Lecture Presenter: Atsutoshi Okura, PhD – Nagaoka University of Technology
9:30 AM – 9:50 AM PST

Flip-Chip Low Inductive and EMC Optimized PCB Power Module
Technical Lecture Presenter: Pierre-Olivier Jeannin, PhD – G2Elab, Université Grenoble Alpes
9:50 AM – 10:10 AM PST

Modeling and Analysis of Multi-Layer High-Voltage Power Modules Design Using Generalized Multiport Network
Technical Lecture Presenter: Yu Chen, PhD – Center for Power Electronics Systems (CPES), Virginia Tech
10:30 AM – 10:50 AM PST

Breaking Barriers: Unleashing the Potential of High-Efficiency 500 W 4-to-1 IBC Through Innovative 3D-PCB Design and Power Inlay Semiconductor Technology
Technical Lecture Presenter: Juan Sanchez, MsC (he/him/his) – Infineon Technologies
10:50 AM – 11:10 AM PST

A Novel Fast-Acting Solid-State DC Circuit Breaker Using Low Requirement IGBT
Technical Lecture Presenter: Taihang He – State Key Laboratory of Advanced Electromagnetic Engineering and Technology