T38 - Reliability & Thermal Performance of Power Modules & Components

Technical Lecture Session Chair(s)

• KV

  Kasunaidu Vechalapu

  Infineon Technologies Americas Corp.
• LG

  Lee Gill

  Sandia National Laboratories

Presentations:

• 1:30 PM – 1:50 PM PST

  Design of a Cylindrical Jet Impingement Cooling System for High-Power Common-Mode Choke in Aerospace Applications
  

  Technical Lecture Presenter: Sam Hemming – McMaster Automotive Resource Centre
• 1:50 PM – 2:10 PM PST

  A Compact Vertically Stacked Converter Module with Thermal Balancing and High-Power Dissipation Capability
  

  Technical Lecture Presenter: Jingyuan Liang – University of Toronto
• 2:10 PM – 2:30 PM PST

  Thermal Modeling of E-Mode GaN HEMTs Under Wide-Range Thermal Cycling Tests
  

  Technical Lecture Presenter: Harish S. Krishnamoorthy, PhD (he/him/his) – University of Houston
• 2:30 PM – 2:50 PM PST

  SymCool™ B-TRAN™ Power Module Design Considerations and Characterization
  

  Technical Lecture Presenter: Mouzhi Dong, MS – Ideal Power Inc.
• 2:50 PM – 3:10 PM PST

  Low Temperature Pb-Free Solder Preform Technology for Molded Power Module Package Attach Designed for Improved Thermomechanical Performance
  

  Technical Lecture Presenter: Ryan W. Mayberry – Indium Corporation